• 专利标题:   Preparation of foam copper, foam iron, foam nickel and foam zinc based on graphene conductive layer by electroplating involves depositing graphene conductive layer on sponge component before electrodepositing.
  • 专利号:   CN114959805-A
  • 发明人:   TIAN J, SUN D
  • 专利权人:   UNIV CHANGCHUN TECHNOLOGY
  • 国际专利分类:   C01B032/19, C25D001/08, C25D003/38
  • 专利详细信息:   CN114959805-A 30 Aug 2022 C25D-001/08 202290 Chinese
  • 申请详细信息:   CN114959805-A CN10537920 18 May 2022
  • 优先权号:   CN10537920

▎ 摘  要

NOVELTY - Preparation of foam copper based on graphene conductive layer by electroplating involves depositing graphene conductive layer on sponge substrate before electrodeposition. USE - Preparation of foam copper, foam iron, foam nickel and foam zinc based on graphene conductive layer (all claimed). ADVANTAGE - The method: provides foam metal, which has low cost; enables easy operation; does not require pretreatment such as chemical plating, roughening, sensitizing, activating and peptization; and is simple. By controlling the immersion and electroplating parameters, the thickness and uniformity of the coating can be controlled, and the foam copper with uniform framework thickness and high porosity can be obtained. The graphene conductive layer is deposited on the sponge component to replace the traditional method of chemical copper plating on the substrate.