• 专利标题:   Temperature equalizing device for enabling heat source to achieve uniform heat dissipation, has radiation layer that is arranged on second surface of substrate.
  • 专利号:   TW631444-U
  • 发明人:   CHENG C, CHUNG M H
  • 专利权人:   LONG RUI CO LTD
  • 国际专利分类:   F28F003/08
  • 专利详细信息:   TW631444-U 01 Sep 2022 F28F-003/08 202290 Pages: 23 Chinese
  • 申请详细信息:   TW631444-U TW203722 13 Apr 2022
  • 优先权号:   TW203722

▎ 摘  要

NOVELTY - This creation discloses a temperature equalizing device, which is a stacked temperature equalizing device arranged on a heat source to improve heat dissipation efficiency and achieve uniform heat dissipation. The temperature equalizing device of this creation includes a substrate, a heat conducting member and a radiation layer; Therefore, the temperature uniformity device of this creation is mainly based on the hardware design of stacking the radiation layer, the substrate, and the heat-conducting member in sequence, so as to effectively physically contact the heat-conducting member and the heat source to be dissipated, so as to dissipate the heat generated by the heat source. By transferring the substrate to a large-area radiation layer made of graphene with high thermal conductivity, and then transferring it to the air, it can effectively improve the heat dissipation efficiency of the heat source to achieve uniform heat dissipation, and the overall temperature uniformity device is thin. major advantages.