▎ 摘　　要

NOVELTY - Inhibiting reinforced phase agglomeration and floating in composite brazing filler metal by transient current bonding involves connecting an upper substrate, a GNSs-SAC solder alloy and a lower substrate in sequence, lapping into a sandwich structure, placing the sandwich structure on a lower side electrode of a transient current binding device, setting the power supply current to 1kA, the discharge time is set to be 120ms, and the bonding pressure to 1.5MPa, after the parameter is set, stepping the pedal air switch, and after the upper and lower electrodes contact, instantaneous discharge, and finishing bonding. USE - Method for enhancing phase agglomeration and floating upward in composite brazing filler metal used for automobile, aviation, integrated circuit and other fields. ADVANTAGE - The microscopic representation of the welding point shows that the bonding time is greatly shortened and effectively inhibits the agglomeration and floating of the graphene, so as to preserve the strengthening effect of graphene to the solder substrate, and improve the comprehensive mechanical property. The method can be used for promoting the popularization and application of the light-reinforced composite brazing filler metal to remove the obstacle.