▎ 摘　　要

NOVELTY - Light emitting diode high temperature heat dissipation coating comprises 20-80 pts. wt. silicone resin, 10-60 pts. wt. epoxy resin, 5-10 pts. wt. low-melting glass powder, 2-15 pts. wt. activated alumina fine powder, mica powder 6-18 parts, 2-12 pts. wt. graphene, 2-16 pts. wt. high temperature resistant filler, 1-4 pts. wt. curing agent, 0.2-1 pts. wt. dispersing agent, 0.1-0.6 pts. wt. leveling agent, and 0.4-1 pts. wt. antifoaming agent. USE - Light emitting diode high temperature heat dissipation coating. ADVANTAGE - The light emitting diode high temperature heat dissipation coating is helps to improves high temperature performance resistance of coating, adhesion and corrosion resistance, cost-effective and improves the economic benefit of the paint production enterprise. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of manufacturing a soft magnetic composite, which involves: (A) weighing the raw materials according to the formula ratio, adding the silicone resin and the epoxy resin to the reaction kettle, and warming up to 300-500 degrees C to melting, turning on the machine at 500 revolution per minute, stirring for 15-30 minutes; (B) adding low-melting glass powder, activated alumina powder, mica powder, graphene and resistant high temperature filler, and increasing speed to 1000 revolution per minute; (C) adding a curing agent, a dispersing agent, a leveling agent and an appropriate amount of water during the dispersion process, and dispersing for 20-40 minutes, and reducing the speed to 300 revolution per minute; and (D) adding defoamer, stirring for 5-10 minutes, reducing to room temperature filling and packaging to get high temperature coating.