▎ 摘　　要

NOVELTY - The utility model claims a packaging structure for semiconductor chip, relating to the technical field of semiconductor chip packaging. comprising a substrate, the top part of the substrate is provided with a chip main body top part the substrate is further provided with a packaging shell for covering the chip main body, the packaging shell is provided with a radiating plate, between the radiating plate and the chip main body is provided with a heat conducting silica gel, the top part plate is uniformly provided with a mounting groove, the mounting groove is provided with a radiating sheet, the top part of the radiating fin is provided with a clamping plate for limiting and reinforcing the radiating fin, two sides of the chip main body is provided with a pin passing through the packaging shell. The packaging structure for semiconductor chip is provided with a radiating plate, a radiating fin, a radiating pipe and a graphene radiating layer, capable of radiating the chip main body in all directions, so that the radiating effect is good.