• 专利标题:   Fabrication method of semiconducting device such as transistor, involves forming graphene sheet, source and drain on sheet, and slot in graphene sheet, and applying etchant to substrate through slot formed in graphene.
  • 专利号:   US2014151640-A1, US8796096-B2, CN103855218-A, CN103855218-B
  • 发明人:   FARMER D B, FRANKLIN A D, SMITH J T
  • 专利权人:   INT BUSINESS MACHINES CORP, INT BUSINESS MACHINES CORP
  • 国际专利分类:   H01L021/20, H01L029/66, H01L029/78, H01L021/02, H01L021/336, H01L029/16, H01L029/786
  • 专利详细信息:   US2014151640-A1 05 Jun 2014 H01L-029/78 201440 Pages: 10 English
  • 申请详细信息:   US2014151640-A1 US693700 04 Dec 2012
  • 优先权号:   US693700

▎ 摘  要

NOVELTY - The fabrication method involves forming a graphene sheet (102) on a substrate (104), forming a source (108) and drain (110) on graphene sheet to define a gap between source and drain, and forming slot in the graphene sheet having width that allows an etchant to pass through the graphene sheet. The etchant is applied to the substrate through the slot formed in graphene sheet to etch the substrate below the graphene sheet. USE - Fabrication method of semiconducting device such as transistor. ADVANTAGE - Reduces impact of stray charge or adsorbed molecules by formation of dual gate structure in slots in suspended graphene bridge. DESCRIPTION OF DRAWING(S) - The drawing shows the cross-sectional view of the graphene field-effect transistor. Graphene sheet (102) Substrate (104) Source (108) Drain (110) Gate metal (124)