▎ 摘　　要

NOVELTY - The board has a build-up circuit structure placed on a substrate (110). A dielectric layer is formed on an inner circuit. An outer circuit is placed on the dielectric layer. A set of conductive via's is penetrated the dielectric layer, and electrically connects the inner circuit and the outer circuit. A graphene oxide layer and a graphene layer are formed on the build-up circuit structure at an interval. The graphene oxide layer is placed to the dielectric layer. A graphene layer is formed in correspondence to the outer circuit. An insulating material layer is placed on the graphene oxide layer and the graphene layer. The insulating material layer includes an opening to expose the graphene layer. USE - Circuit board. ADVANTAGE - The board allows a conductive material layer to be electrically connected to the build-up circuit structure, thus enhancing heat dissipation effect of the board and protecting the outer circuit from oxidation. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing a circuit board. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a circuit board. 120Release layer 130Seed layer 110Substrate