• 专利标题:   Heating device of glass toughening furnace heated by medium-high temperature composite graphene, has electrode leading-out wire of composite graphene heating layer on substrate is led out from side of heat insulating bottom plate.
  • 专利号:   CN215912245-U, CN115866818-A
  • 发明人:   GUO C, SHI J, WANG J
  • 专利权人:   ANHUI JIASHITONG ELECTRONIC TECHNOLOGY
  • 国际专利分类:   B01D019/04, B01F031/80, B01J019/00, B01J019/10, C09D183/04, C09D007/61, H05B003/02, H05B003/03, H05B003/14, H05B003/62
  • 专利详细信息:   CN215912245-U 25 Feb 2022 H05B-003/62 202225 Chinese
  • 申请详细信息:   CN215912245-U CN22276071 19 Sep 2021
  • 优先权号:   CN11102463, CN22276071

▎ 摘  要

(CN215912245-U) NOVELTY - A glass toughening furnace heating device for heating medium-high temperature composite graphene, the heating device from up to down is as follows: an insulating heat conducting layer, a first adhesive layer, a composite graphene heating layer, an electrode circuit, a second adhesive layer, a substrate, a third adhesive layer and a heat insulation bottom plate, the substrate is a hard plate with smooth surface, the substrate is coated with a second adhesive layer, the second adhesive layer is coated with composite graphene heating layer, after calcining and curing; the composite graphene heating layer is further coated with a first adhesive layer, the first adhesive layer is covered with a heat-conducting insulating layer, the lower part of the substrate is a heat-insulating insulating bottom plate, the heat-insulating insulating bottom plate is a shallow groove-type heat insulating plate, the substrate is embedded in the heat-insulating insulating plate shallow groove, and the third adhesive layer is calcined and solidified and fixed by the third adhesive layer, the electrode leading-out wire of the composite graphene heating layer on the substrate is led out from the side of the heat insulating bottom plate, and it is connected with the commercial power to form the power loop of the heating device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing glass tempering furnace heating device, which involves: a. taking some metal powder mixed slurry into the reactor, taking dispersant, defoamer, antioxidant and putting into the reactor in turn for stirring and ultrasonic dispersion, reacting at 50-80℃ for 1-2 hours to obtain mixed thermoelectric slurry A; b. taking a number of graphene heating slurry, conductive carbon black, and nano-silver wire solution and putting into the reaction kettle to fully stir, reacting at room temperature for 30-60 minutes, taking dispersant, wetting agent, placing leveling reagents in the reactor in turn for stirring and ultrasonic dispersion, and reacting for 15-30 minutes to form a graphene mixed heating slurry B; c. taking the slurry A and slurry B, putting into the reaction kettle according to the weight ratio of 3.0-6.0:2.0-5.0, taking deionized water, thermal conductive silicone grease, thickener, emulsifier, putting into the reaction kettle, stirring and ultrasonically dispersing, reacting at 50-80℃ for 30-60 minutes, testing the viscosity of the reaction mixture, the viscosity is 8000-15000cP; d. taking piece of high-temperature glass substrate, basically coating a layer of high-temperature glass glue on the glass, and then coating the mixed slurry with a coating thickness of 100-200 μm, and sintering at high temperature for 30-60 minutes in a nitrogen environment, where the sintering temperature is 600-800℃, cooling to room temperature, and setting aside; e. taking the spare substrate, printing the chromium-zirconium-copper electrode circuit on the graphene mixed slurry layer, coating a layer of high-temperature insulating and heat-conducting layer on the side of the chromium-zirconium-copper electrode circuit, where high-temperature heat-conducting insulating layer is high temperature resistant ceramic insulating coating, the coating thickness is 0.1-1mm, spare; and f. taking high-temperature heat-insulating base plate of the same size, where heat-insulating base plate has a shallow groove, and the bottom surface of the shallow groove is coated with a layer of high-temperature glass glue, inserting the spare substrate into the shallow groove of the heat-insulating base plate, putting the heat-insulating bottom plate in a nitrogen environment, sintering and solidifying at high temperature for 30-50 minutes, the sintering temperature is 600-800℃, taking out and cooling at room temperature, then welding the electrode lead-out wire through the lead-out terminal of the electrode circuit.