• 专利标题:   Manufacture of substrate for electronic apparatus, involves forming silicon carbide layer on silicon substrate, heating upper surface of silicon carbide layer using gas, and forming graphene layer on surface of silicon carbide layer.
  • 专利号:   JP2014240173-A, JP6163024-B2
  • 发明人:   SAI J, SUEMITSU M, FUKIDOME H, MAKABE I, NAKABAYASHI T, TATENO Y
  • 专利权人:   SUMITOMO ELECTRIC IND LTD, UNIV TOHOKU
  • 国际专利分类:   B32B009/00, C01B031/02, H01L021/20, H01L021/324, H01L021/336, H01L029/06, H01L029/78, H01L029/786, C01B032/184
  • 专利详细信息:   JP2014240173-A 25 Dec 2014 B32B-009/00 201503 Pages: 17 Japanese
  • 申请详细信息:   JP2014240173-A JP124110 12 Jun 2013
  • 优先权号:   JP124110

▎ 摘  要

NOVELTY - Manufacture of substrate (100) involves forming silicon carbide layer (14) on a silicon substrate (10), heating upper surface of silicon carbide layer using gas containing hydrogen, and forming a graphene layer (16) on the upper surface of silicon carbide layer. USE - Manufacture of substrate used for electronic apparatus (all claimed) e.g. transistor. ADVANTAGE - The method provides electronic apparatus with high quality. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for electronic apparatus. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of substrate. Silicon substrate (10) Nitride semiconductor layer (12) Silicon carbide layer (14) Graphene layer (16) Substrate (100)