• 专利标题:   Method for manufacturing temperature self-sensing function featured packaged shape memory alloy soft driver of robot used in e.g. medical field, involves changing temperature self-sensing function featured packaged shape memory alloy soft driver to curling state after cooling shape memory alloy wire.
  • 专利号:   CN114888533-A, CN114888533-B
  • 发明人:   MA Y, JIAO Y, CHENG J, FENG X
  • 专利权人:   UNIV TSINGHUA
  • 国际专利分类:   B23P015/00, G01K001/14, G01K007/18
  • 专利详细信息:   CN114888533-A 12 Aug 2022 B23P-015/00 202273 Chinese
  • 申请详细信息:   CN114888533-A CN10656858 10 Jun 2022
  • 优先权号:   CN10656858

▎ 摘  要

NOVELTY - The method involves providing a shape memory alloy wire (1). A flexible temperature sensor (2) is arranged against the shape memory alloy wire. The shape memory alloy wire and the flexible temperature sensor are encapsulated between a pre-stretching layer flexible substrate (3) and a packaging layer flexible substrate (4). A temperature self-sensing function featured packaged shape memory alloy soft driver is operated in a curled state. The shape memory alloy wire is heated by current. The temperature self-sensing function featured packaged shape memory alloy soft driver is unfolded. The packaged shape memory alloy soft driver is changed to the curling state after cooling the shape memory alloy wire, where the pre-stretching layer and packaging layer flexible substrates are silica gel doped with heat conducting material, where the heat conducting material comprises liquid alloy, metal powder and graphene powder and a transition layer comprises chromium. USE - Method for manufacturing a temperature self-sensing function featured packaged shape memory alloy soft driver of a robot used in e.g. medical, military reconnaissance and disaster rescue. ADVANTAGE - The method enables can recover the curling state after cooling the wire, so that the temperature of a wire can be measured in an accurate manner. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a temperature self-sensing function featured packaged shape memory alloy soft driver. 1Shape memory alloy wire 2Flexible temperature sensor 3Pre-stretching layer flexible substrate 4Packaging layer flexible substrate