▎ 摘　　要

NOVELTY - Resin composition comprises: (A) bismaleimide compounds (I); and (B) a vinyl-containing elastomer, where the weight ratio of (I) to the vinyl-containing elastomer is 20:1-1:1. USE - The composition is useful for preparing prepreg, which is useful in metal-clad laminate for printed circuit board (all claimed). ADVANTAGE - The composition has excellent properties including good electric properties (low dielectric constant and low dissipation factor), adhesion strength to copper foils (peeling) and heat resistance, rendering it particularly suitable for use as an electronic material in high-frequency technical fields. DETAILED DESCRIPTION - Resin composition comprises: (A) bismaleimide compounds of formula (I); and (B) a vinyl-containing elastomer, where the weight ratio of (I) to the vinyl-containing elastomer is 20:1-1:1. R1 = organic group. INDEPENDENT CLAIMS are also included for: (1) a prepreg, which is prepared by impregnating a substrate with the composition or by coating the composition onto a substrate and drying the impregnated or coated substrate; (2) a metal-clad laminate, which is prepared by laminating the prepreg and a metal foil and drying the coated metal foil; and (3) a printed circuit board, which is prepared from the metal-clad laminate.