▎ 摘　　要

NOVELTY - Component carrier comprises a stack (102) comprising electrically conductive layer structures (104) and at least one electrically insulating layer structure (106), a back-drill hole extending through at least part of the at least one electrically insulating layer structure towards the end portion, and an etching neck connecting the back-drill hole with the end portion of the vertical through-connection, where the electrically conductive layer structures comprise an electrically conductive vertical through-connection and a horizontally extending electrically conductive trace (110) electrically coupled with an end portion of the vertical through-connection. USE - The component carrier is useful as a printed circuit board, a substrate, interposer, and a laminate-type component carrier. ADVANTAGE - The carrier reduces stub length, increases performance, and prevents undesired damaging of functional part. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) A method of manufacturing the component carrier; and (2) A method. DESCRIPTION OF DRAWING(S) - The drawing shows a 3-dimensional view of the component carrier. Stack (102) Electrically conductive layer structures (104) Electrically insulating layer structure (106) Horizontally extending electrically conductive trace (110)