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  • 专利标题:   Tin-based interconnection material used for three-dimensional chip stack package, comprises specified amount of graphene nanoparticles, silicon carbide nanowires and tin.
  • 专利号:   CN105047645-A
  • 发明人:   GUO Y, SUN L, ZHANG L
  • 专利权人:   UNIV JIANGSU NORMAL
  • 国际专利分类:   B82Y040/00, H01L021/60, H01L021/768, H01L023/488, H01L023/532
  • 专利详细信息:   CN105047645-A 11 Nov 2015 H01L-023/532 201604 Pages: 7 Chinese
  • 申请详细信息:   CN105047645-A CN10369924 26 Jun 2015
  • 优先权号:   CN10369924

▎ 摘　　要

NOVELTY - A tin-based interconnection material comprises 5-8 wt.% graphene nanoparticles, 6-10 wt.% silicon carbide nanowires and remainder of tin. USE - Tin-based interconnection material is used for three-dimensional chip stack package. ADVANTAGE - The tin-based interconnection material has high reliability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of tin-based interconnection material.