▎ 摘　　要

NOVELTY - Preparing graphene-doped fluorine-containing silicon-based epoxy-based polymer encapsulating material comprises e.g. preparing fluorine-containing silicone epoxy polymer by uniformly mixing alicyclic epoxy-containing acrylic monomer, vinyl silane monomer, and acetone with magnetic stirring, heating at 50-80 degrees C in the presence of nitrogen, adding initiator, continuing heating for 3-5 hours, transferring the resulting product to rotary steam, removing solvent and by-product, uniformly mixing epoxy group-containing polysiloxane, fluorine-containing siloxanes, water, catalyst, and acetone. USE - The method is useful for preparing graphene-doped fluorine-containing silicon-based epoxy-based polymer encapsulating material (claimed). ADVANTAGE - The polymer encapsulating material has good weather resistance property, high thermal conductivity, low coefficient thermal expansion, changed inner stress value, good mechanical property and impact resistance property. DETAILED DESCRIPTION - Preparing graphene-doped fluorine-containing silicon-based epoxy-based polymer encapsulating material comprises (i) preparing fluorine-containing silicone epoxy polymer by uniformly mixing 30-45 pts. wt. alicyclic epoxy-containing acrylic monomer, 10-20 pts. wt. vinyl silane monomer, and 50-100 pts. wt. acetone with magnetic stirring, heating at 50-80 degrees C in the presence of nitrogen, adding 2-5 pts. wt. initiator, continuing heating for 3-5 hours, transferring the resulting product to rotary steam, removing solvent and by-product, to obtain the product containing epoxy-containing polysiloxanes, uniformly mixing 5-15 pts. wt. epoxy group-containing polysiloxane, 10-35 pts. wt. fluorine-containing siloxanes, water, catalyst, and 50-100 pts. wt. acetone, uniformly stirring, heating at 60-90 degrees C, carrying out reaction in the presence of nitrogen for 5-8 hours, steaming the product to remove solvent and by-product, to obtain fluorine-containing silicon-containing epoxy-based polymer; (ii) preparing modified graphene oxide by taking 4-6 pts. wt. graphene oxide, 600-800 pts. wt. deionized water, and 400-500 pts. wt. anhydrous ethanol, carrying out ultrasonic dispersion at 300-400 W power for 20-30 minutes, adding 6-7 pts. wt. KH-560, carrying out dispersing under ultrasonic condition for 1-2 hours, carrying out centrifugation at 4000-5000 rotations/minute, washing the precipitate with deionized (3-5 times), where the washed precipitate and deionized water is in a mass ratio of 1:15-25, carrying out ultrasonic dispersion at 200-250 W for 35-45 minutes, adding 12-24 pts. wt. hydrazine hydrate, carrying out ultrasonic treatment at 60-70 degrees C for 3-5 hours, carrying out centrifugation, separating the precipitate by centrifugation, washing the precipitate with deionized water to neutral, placing in an oven, drying at 120-130 degrees C for 4-6 hours, to obtain modified graphene oxide; (iii) taking 13-15 pts. wt. epoxy resin, 3-6 pts. wt. modified fused graphene, 1-5 pts. wt. methylnadic anhydride, 16-18 pts. wt. above-mentioned fluorine-containing silicone epoxy polymer, 0.5-1 pts. wt. titanate coupling agent, 1-3 pts. wt. hydrogenated silicone oil crosslinking agent; (iv) uniformly mixing the above mentioned components, heating with stirring, defoaming the mixture in a vacuum degassing machine, defoaming for 5-7 hours, adding defoaming mixture to a hopper of twin screw extruder, carrying out extrusion having a screw speed of 600-800 rotations/minute, carrying out melt extrusion, carrying out water-free pelletizing, to obtain pellets, drying under low temperature pressure, carrying out injection molding using injection molding machine, to obtain the final product.