• 专利标题:   Formulation for copper-graphene nanoplatelets nanocomposite coatings comprises copper sulfate pentahydrate, sulfuric acid, and graphene nanoplatelets.
  • 专利号:   ZA202201417-A
  • 发明人:   KATARKAR A S, PINGALE A D, BELGAMWAR S U, BHAUMIK S
  • 专利权人:   KATARKAR A S, PINGALE A D, MAJUMDER B, BELGAMWAR S U, BHAUMIK S
  • 国际专利分类:   C01B000/00
  • 专利详细信息:   ZA202201417-A 29 Jun 2022 C01B-000/00 202334 Pages: 20 English
  • 申请详细信息:   ZA202201417-A ZA001417 31 Jan 2022
  • 优先权号:   ZA001417

▎ 摘  要

NOVELTY - A formulation for copper-Graphene nanoplatelets (copper-GNPs) nanocomposite coatings comprises 80-120 g.L-1copper sulfate pentahydrate, 20-40 g.L-1sulfuric acid, and 100-400 mg.L-1graphene nanoplatelets (GNPs). USE - Formulation for copper-graphene nanoplatelets nanocomposite coatings for enhancement of pool boiling performance of R-134a (1,1,1,2-Tetrafluoroethane). ADVANTAGE - The formulation improves pool boiling heat transfer (BHT). DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for two-step electrodeposition method for formulation for copper-GNPs nanocomposite coatings, which involves dissolving 80-120 g.L-1copper sulfate pentahydrate and 20-40 g.L-1sulfuric acid in deionized water for preparing a desired quantity of electrolyte, adding 100-400 mg.L-1graphene nanoplatelets (GNPs) in a plating bath with continuous stirring at a defined time interval to form an electrolyte solution, machining copper test sample for achieving stronger adhesion of the copper-GNPS nanocomposite coating to the copper surface, where the copper-substrate is cleaned to remove impurities, electrodepositing the machined Cu-GNPs nanocomposite coating at a high current density of 0.4 A.cm-2for about 60 seconds, resulting in a porous structure due to hydrogen bubbles evaluation at a cathode surface, and employing a lower current density of 0.05 A.cm-2for 20-40 minutes to strengthen the developed porous copper-GNPs nanocomposite coating.