▎ 摘　　要

NOVELTY - An electronic packaging material comprises a substrate and a reinforcement structure. The substrate is made from aluminum and aluminum alloy powder. The reinforcement structure is made from 0.5-3 %mass graphene oxide and 35-65 %mass silicon carbide particles. The aluminum alloy powder comprises 55 %mass aluminum-silicon alloy powder, 15 %mass aluminum-titanium-boron alloy powder, 15 %mass aluminum-beryllium alloy powder and 15 %mass aluminum. USE - Electronic packaging material for military electronic device, for portable aerospace device, and military power hybrid circuits used in weight sensitive fields, microwave tube carrier, heat sink for multi-chip module and fabrication of ultra-high-power module. ADVANTAGE - The electronic packaging material has density of lower than 3.1 g/cm3, and thermal conductivity of greater than 180 W/(mK), and is lightweight, so that the comprehensive performance of military electronic equipment is greatly improved.