▎ 摘　　要

NOVELTY - An adhesion promoting layer (10) includes a metal oxide layer (10b) arranged on inorganic or organic-inorganic hybrid substrate (100), and an interface layer (10a) arranged between the metal oxide layer and the inorganic or organic-inorganic hybrid substrate, where the metal oxide layer comprises metal oxide and a chelating agent, and the interface layer comprises the metal oxide, the chelating agent and metal-nonmetal-oxide composite material. USE - Adhesion promoting layer used for depositing conductive layer on inorganic or organic-inorganic hybrid substrate to form conductive structure (all claimed). ADVANTAGE - The adhesion promoting layer has high acid and alkali resistance. In the wet deposition process, the adhesion promoting layer may not be damaged by etching from process solution with high acidity and alkalinity, for achieving high adhesion between the conductive layer and inorganic or organic-inorganic hybrid substrate. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) method for depositing conductive layers (102) and (104) on inorganic or organic-inorganic hybrid substrate, which involves: (a) coating adhesion promoting material on the inorganic or organic-inorganic hybrid substrate; (b) performing heat treatment to transform the crystalline phase of the adhesion promoting material to form an adhesion promoting layer; and (c) performing wet deposition process to form a conductive layer on the adhesion promoting layer; and (2) a conductive structure, which includes inorganic or organic-inorganic hybrid substrate, adhesion promoting layer arranged on the inorganic or organic-inorganic hybrid substrate, and conductive layer arranged on the adhesion promoting layer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional view of the adhesion promoting layer. Adhesion promoting layer (10) Interface layer (10a) Metal oxide layer (10b) Inorganic or organic-inorganic hybrid substrate (100) Conductive layer (102) Conductive layer (104)