• 专利标题:   Performing interconnect spacing on crosstalk for multi-layered graphene nanoribbon, by providing impact of delay under induced crosstalk and peak noise for scaled down technology and validating simplified equivalent ESC model.
  • 专利号:   IN202111059573-A
  • 发明人:   KUMBHARE V R, SINGH S K, BHARDWAJ P, ROY M, MISHARA S K
  • 专利权人:   ABES ENG COLLEGE
  • 国际专利分类:   G06F013/16, G06F013/42, G06F030/367, H01L021/285, H01L021/768
  • 专利详细信息:   IN202111059573-A 31 Dec 2021 G06F-030/367 202238 Pages: 20 English
  • 申请详细信息:   IN202111059573-A IN11059573 21 Dec 2021
  • 优先权号:   IN11059573

▎ 摘  要

NOVELTY - Performing interconnect spacing on crosstalk for multi-layered graphene nanoribbon, comprises: providing the impact of delay under induced crosstalk and peak noise for scaled down technology using different interconnect spacing using industry standard HSPICE; and validating a simplified equivalent ESC model at advanced technology for different spacing against MTL model of rough-edged multi-layered graphene nanoribbon (MLGNR), where the ESC model exhibits an accuracy of 99.1% is used to demonstrate the peak noise and delay under crosstalk for the coupled driver interconnect load (DIL) setup and the MTL and equivalent ESC models of MLGNR are validated by using a coupled interconnect line. USE - The method is useful for performing interconnect spacing on crosstalk for multi-layered graphene nanoribbon. ADVANTAGE - None given.