• 专利标题:   Conductive copper foil for earphone circuit board, has reinforcing structure that is set in copper base layer for improving radiating effect, and base layer that is fixedly connected with main portion through connecting welding wires.
  • 专利号:   CN217904724-U
  • 发明人:   LIN X, LI M, LIN W
  • 专利权人:   SHENZHEN HUAXIN ELECTRONIC TECHNOLOGY CO
  • 国际专利分类:   H05K001/02
  • 专利详细信息:   CN217904724-U 25 Nov 2022 H05K-001/02 202303 Chinese
  • 申请详细信息:   CN217904724-U CN21514237 16 Jun 2022
  • 优先权号:   CN21514237

▎ 摘  要

NOVELTY - The utility model claims a conductive copper foil for headset circuit board comprising a winding drum, a conductive copper foil main body, a conductive copper foil, a sticky surface, a release paper and an auxiliary radiating assembly. The utility model is provided with an auxiliary radiating device, the copper base layer, the radiating coating is matched with the radiating hole, it can realize the educing of the heat generated by the earphone circuit board and under the matching of the anti-static layer and the anti-oxidant, it can realize the elimination of the anti-oxidant and the static electricity, so as to reach the advantages of strengthening the radiating performance of the conductive copper foil main body and realizing the auxiliary leading out of the heat of the earphone circuit board and the inner part of the copper base layer is provided with a reinforcing structure, the first graphite radiating fin, the second graphite radiating fin, the guide groove and the heat conducting silica gel layer are matched with each other, the heat can be quickly absorbed and led out to radiate heat, and under the matching of the graphene layer and the gas conveying groove, it can accelerate the heat absorption and lead-out effect, so as to reach the radiating effect of the reinforcing auxiliary radiating device, and the heat is quickly absorbed. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the conductive copper foil for earphone circuit board to claim.