▎ 摘　　要

NOVELTY - Interconnect structure, comprises a conductive wiring (300) having a certain pattern, a dielectric layer (200) on side surfaces of the conductive wiring, a capping layer (400) on the conductive wiring and a graphene layer on the dielectric layer. The graphene layer (100) comprises a graphene material, and a ratio of carbons having sp3 bonds to carbons having sp2 bonds in the graphene material is 1 or less. USE - Interconnect structure used in electronic device (claimed). ADVANTAGE - The interconnect structure including a capping layer, which is capable of reducing the resistance of a conductive wiring, so as to limit and/or prevent deterioration of electrical characteristics, and also having graphene layer that has hydrophobic surface characteristics is on a dielectric layer, which is capable of limiting and/or preventing impurities from permeating the dielectric layer, so as to limit and/or prevent an increase in the dielectric constant of the dielectric layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device, which comprises a substrate and an interconnect structure on the substrate, where the interconnect structure comprises a conductive wiring having a certain pattern, a dielectric layer on side surfaces of the conductive wiring, a capping layer on the conductive wiring, and a graphene layer on the dielectric layer. The graphene layer comprises a graphene material, and a ratio of carbons having sp3 bonds to carbons having sp2 bonds in the graphene material is 1 or less. DESCRIPTION OF DRAWING(S) - The drawing shows cross-sectional views of electronic devices. 100Graphene layer 200Dielectric layer 300Conductive wiring 400Capping layer 500Barrier layer