▎ 摘　　要

NOVELTY - Graphene-containing PCB copper composite plating solution includes a copper ion source, where the copper ion source is preferably copper chloride, copper sulfate. The content of the copper ion source is 55-95g/L, sulfuric acid is preferred, with a concentration of 70-200mL/L, and more preferably 85-150 ml/L. It is characterized in that the plating solution further contains graphene, and the graphene preferably has a lateral dimension of 0.1-5 mu m, and its content is 0.05-2g/L, preferably 0.1-1g/L. The composite plating solution contains graphene dispersant, which is a crown ether compound, especially a crown ether having more than 20 atoms on the crown ether ring, and particularly preferred is dibenzo 30-crown-10. USE - Graphene-containing PCB copper composite plating solution. ADVANTAGE - The graphene-containing PCB copper composite plating solution improves conductivity of graphene. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for PCB electroplating by using the electroplating solution, which involves preparing a composite plating solution according to the formulation, degreasing and ultrasonic cleaning of the PCB board, putting the substrate processed into the composite plating solution, applying electricity for electroplating, and using air-blowing stirring during the plating process, slotting, smoothing, anti-oxidation treatment, and drying.