▎ 摘　　要

NOVELTY - The component (400) has a graphene copper plating layer (420) attached on a non-metallic substrate (410) i.e. glass substrate, and a copper body (421) adhered to the non-metal substrate. A set of graphene copper clad layers are attached to the copper body. Pin pieces are inserted and fixed in a graphene body. Graphene pieces (422) are dispersed and distributed in the copper body. A circuit is provided on a non metal substrate. The graphene copper layer is electrically connected to the circuit. Thickness of the graphene copper plating layer is 0.01-1.5 micrometers. USE - Graphene copper-plated electronic component. ADVANTAGE - The graphene copper-plated electronic component has better thermal and electrical conduction properties in a narrow structure, and realizes better heat dissipation and electric conduction effects even if only the copper plating layer is plated, so that the cost can be lowered by reducing the amount of target material used, when graphene is expanded into a shape of a thin layer plane. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a graphene copper-plated electronic component. 400Graphene copper-plated electronic component 410Non-metallic substrate 420Graphene copper plating layer 421Copper body 422Graphene pieces