• 专利标题:   Lead-free copper-clad plate comprises a glass fiber cloth and a copper foil which are glued and compounded using a resin glue solution.
  • 专利号:   CN113844128-A, CN113844128-B
  • 发明人:   WU H, CHEN Y
  • 专利权人:   JIANGSU YAO HONG ELECTRONICS CO LTD
  • 国际专利分类:   B32B017/02
  • 专利详细信息:   CN113844128-A 28 Dec 2021 B32B-017/02 202227 Chinese
  • 申请详细信息:   CN113844128-A CN11057613 09 Sep 2021
  • 优先权号:   CN11057613

▎ 摘  要

NOVELTY - A lead-free copper-clad plate comprises a glass fiber cloth and a copper foil which are glued and compounded using a resin glue solution. USE - As lead-free copper-clad plate. ADVANTAGE - The lead-free copper-clad plate has high heat resistance, moisture resistance, flame retardance and glass transition temperature. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the preparation of lead-free copper-clad plate. The method involves: 1) dissolving 1-naphthol in a toluene solution, heating at 70-90degrees Celsius, followed by adding anhydrous aluminum chloride catalyst, slowly adding dicyclopentadiene toluene solution, heating at 110-120degrees Celsius, performing reflux reaction for 7 hours, cooling to room temperature, adding sodium bicarbonate, washing reaction product to neutral, performing reduced pressure recovery to form a product (1) which is subjected to reflux reaction with paraformaldehyde, p-toluene sulfonic acid and methyl isobutyl ketone at 160degrees Celsius for 6-8 hours, followed by washing to neutral, performing reduced pressure recovery to form product (2) which is reacted with trimethyl benzyl ammonium chloride, sodium hydroxide and epoxy chloropropane at 80-100degrees Celsius for 4-5 hours, followed by cooling to room temperature, filtering, washing to neutral, and performing reduced pressure distillation to form naphthalene-containing epoxy resin; 2) uniformly mixing phenol, formaldehyde and nano silicon dioxide, performing ultrasonic treatment for 0.5-1hours, adding barium hydroxide, reacting at 60-70degrees Celsius, for 0.5-1hours, further reacting at 90-100degrees Celsius, for 1.5-2 hours to form modified phenolic resin; 3) reacting uniformly mixed bisphenol A type epoxy resin and phenolic aldehyde type cyanate ester resin at 80-100degrees Celsius for 30-40 minutes to form modified phenolic aldehyde type cyanate ester resin; 4) dissolving graphene oxide in absolute ethyl alcohol, adding gamma-glycidyl ether oxypropyltrimethoxysilane, reacting for 2-3 hours to form modified graphene oxide, adjusting pH of absolute ethyl alcohol to 3.5-5.5, using glacial acetic acid, adding gamma-aminopropyltriethoxysilane and nano-silica, performing ultrasonic treatment for 0.5-1hours to form modified nano-silica which is reacted with modified graphene oxide for 4-5 hours, followed by performing ultrasonic treatment for 1-2 hours, washing with absolute ethyl alcohol, and drying to form a hybrid composite material; 5) reacting magnesium hydroxide and ethanol solution of cresyl diphenyl phosphate for 1-2 hours, performing suction filtration and drying at 120-140degrees Celsius, mixing preset amounts of naphthalene-containing epoxy resin, modified phenolic cyanate resin, hybrid composite material, modified magnesium hydroxide, talcum powder and butanone solution to form resin glue solution; 6) soaking glass fiber cloth in resin glue solution for 10-15 minutes followed by drying at 100-140degrees Celsius, overlapping several prepregs, cutting, and covering copper foils on two sides, and carrying out hot pressing at 220-250degrees Celsius for 120-240 minutes to form the lead-free copper-clad plate.