• 专利标题:   Thermosetting polymer conductive material comprises epoxy resin, copper nanowires, dicyandiamide, derivative of dimethylurea, graphene, polyimide, melamine formaldehyde resin, polyurethane, phenolic resin and binder.
  • 专利号:   CN107226998-A
  • 发明人:   WU W
  • 专利权人:   HEFEI LIXIAN POWER ENG CO LTD
  • 国际专利分类:   C08K013/04, C08K003/04, C08K003/08, C08K007/00, C08K007/06, C08L061/06, C08L061/28, C08L063/00, C08L075/04, C08L079/08
  • 专利详细信息:   CN107226998-A 03 Oct 2017 C08L-063/00 201781 Pages: 6 Chinese
  • 申请详细信息:   CN107226998-A CN10479801 22 Jun 2017
  • 优先权号:   CN10479801

▎ 摘  要

NOVELTY - Thermosetting polymer conductive material comprises 10-30 pts. wt. epoxy resin, 20-20 pts. wt. copper nanowires, 5-10 pts. wt. dicyandiamide, 5-14 pts. wt. derivative of dimethylurea, 1-10 pts. wt. graphene, 3-8 pts. wt. polyimide, 1-5 pts. wt. melamine formaldehyde resin, 0.3-1.5 pts. wt. polyurethane, 0.5-7.5 pts. wt. phenolic resin, 2-8 parts chopped carbon fiber and 0.5-3.5 pts. wt. binder. USE - Used as thermosetting polymer conductive material. ADVANTAGE - The conductive material: has low cost, can be produces on a large scale, has high strength, temperature resistance and good weathering resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the thermosetting polymer, comprising (i), preparing organic solution, dissolving the binder in an organic solvent at 40-50 degrees C, (ii) adding aqueous solution of divalent metal copper salt into a aliphatic alkylamine to obtain mixed solution, controlling the molar ratio of copper ion and alkylamine to 1:1-20, stirring and sealing the mixed solution, heating at 100-200 degrees C for 60-90 minutes, cooling to room temperature, centrifuging and washing to obtain copper nanowires, (iii) taking copper nanowires, epoxy resin and remaining raw materials into the organic solution, under the protection of gas, fully dispersing for 2-24 hours and curing to obtain thermosetting polymeric conductive material.