▎ 摘　　要

NOVELTY - Light-emitting diode encapsulating material comprises 10-40 wt.% curing agent, 0.05-1% graphene, 40-60 wt.% epoxy resin and 0.5-2% accelerant. USE - Used as Light-emitting diode encapsulating material. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing LED encapsulation material, comprising mixing curing agent with graphene, adding epoxy resin and accelerator into the graphene mixed solution, ultrasonicating to form a graphene and epoxy resin complex; or mixing silane agent, alkali ion exchange resin and graphite, heating to form a packaging material sample and removing the impurity in the packaging material sample.