▎ 摘　　要

NOVELTY - Preparing high thermal conductivity composite material comprises (S1) oxidizing graphene and silicon carbide nanowire (SiCnw) respectively with hydrogen peroxide to obtain oxidized graphene and oxidized SiCnw, (S2) reacting graphene oxide and oxidized SiCnw with silane coupling agent respectively to obtain coupling agent-modified graphene and coupling agent-modified SiCnw, (S3) adding the graphene modified by the coupling agent and the SiCnw modified by the coupling agent respectively to the polyelectrolyte solution, (S4) ultrasonically treating the modified graphene and modified Sicnw obtained in step (S3) to obtain a graphene dispersion and a Sicnw dispersion, mixing graphene dispersion and SiCnw dispersion, preparing graphene/SiCnw composite film by self-assembly method, and freezing and drying the composite film to obtain modified graphene/SiCnw composite film, and (S5) sealing the graphene/SiCnw composite film modified in the step (S4) in a vacuum bag. USE - The method is useful for preparing high thermal conductivity composite material. ADVANTAGE - The method: is simple; can realize the large-scale preparation of epoxy resin nano-composite materials; and is beneficial to promote the use of epoxy resin nano-composite materials. The composite material has high mechanical properties and thermal conductivity, which can expand the application field of epoxy resin. DETAILED DESCRIPTION - Preparing high thermal conductivity composite material comprises (S1) oxidizing graphene and silicon carbide nanowire (SiCnw) respectively with hydrogen peroxide to obtain oxidized graphene and oxidized SiCnw, (S2) reacting graphene oxide and oxidized SiCnw with silane coupling agent respectively to obtain coupling agent-modified graphene and coupling agent-modified SiCnw, (S3) adding the graphene modified by the coupling agent and the SiCnw modified by the coupling agent respectively to the polyelectrolyte solution, and obtaining the polyelectrolyte modified graphene and the polyelectrolyte modified SiCnw by the reaction, (S4) ultrasonically treating the modified graphene and modified Sicnw obtained in step (S3) to obtain a graphene dispersion and a Sicnw dispersion, mixing graphene dispersion and SiCnw dispersion, preparing graphene/SiCnw composite film by self-assembly method, and freezing and drying the composite film to obtain modified graphene/SiCnw composite film, and (S5) sealing the graphene/SiCnw composite film modified in the step (S4) in a vacuum bag, uniformly mixing the resin and the curing agent to prepare a glue solution, soaking the composite film with the glue solution through the dipping process, and obtaining the graphene/SiCnw/epoxy resin composite material after heating and curing.