▎ 摘　　要

NOVELTY - Flexible substrate for photoelectronic device, comprises e.g. a flexible substrate and a conductive layer, which are combined by a dual-cure adhesive, where the conductive layer is thin carbon nanotube layer filled with either graphene or graphene doped with the dual-cure adhesive, the flexible substrate is of graphene doped with the dual-cure adhesive, and the adhesive is cured by ultraviolet (UV) light curing-curing system, UV light curing-microwave curing system, UV light curing-anaerobic curing system or UV light curing-electronic beam curing system or cation type UV light curing system. USE - Useful as a flexible substrate for photoelectronic device. ADVANTAGE - The flexible substrate: solves problem of poor bonding force between thin carbon nanotube layer and the substrate; and improves conductivity of conductive layer and barrier ability of the substrate to water and oxygen. DETAILED DESCRIPTION - Flexible substrate for photoelectronic device, comprises a flexible substrate and a conductive layer, which are combined by a dual-cure adhesive, where the conductive layer is thin carbon nanotube layer filled with graphene or graphene doped with the dual-cure adhesive, the carbon nano-tube layer has a thickness of less than or equal to 100 nm, the adhesive is cured by UV light curing-curing system, UV light curing-microwave curing system, UV light curing-anaerobic curing system or UV light curing-electronic beam curing system or cation type UV light curing- curing system. The free radical type UV light curing-thermal curing system comprises (in parts by weight) unsaturated polyester resin, acrylic resin or polythiol-polyene (30-40), epoxy resin, isocyanate, amino resin or free radical thermal curing agent (30-45), styrene or its derivatives, or acrylic acid with single functional group or multi-functional groups (0.2-3), photoinitiator (0.1-3), and photosensitizer and an auxiliary agent (0.2-6) as raw materials, and curing process comprises either making UV light curing, then heating and curing, and then making UV light curing, or heating and curing, then making UV light curing and then heating and curing. The free radical type UV light curing-microwave curing system comprises raw materials, which are same as that of UV light curing-thermal curing system, and curing process is either making UV light curing, followed by curing via microwave, and then making UV light curing, or carrying out microwave curing, then making UV light curing and then heating or microwave curing. The free radical type UV light curing-anaerobic curing system comprises (in parts by weight) unsaturated polyester resin, acrylic resin or polythiol-polyene (55-65), dimethacrylate polyol ester or bisphenol-A epoxy polyol ester (20-30), styrene or its derivatives or acrylic acid with single functional group or multi-functional groups (0.2-3), photoinitiator (0.1-3), photosensitizer and auxiliary agent (0.2-6) as raw materials, and curing process is making UV light curing, then performing anaerobic curing in absence of light under anaerobic condition, and then making UV light curing. The free radical type UV light curing-electronic beam curing system comprises (in parts by weight) unsaturated polyester resin or acrylic resin or polythiol-polyene (35-40), bisphenol A vinyl ester resin (50-55), styrene or its derivatives or acrylic acid with single functional group or multi-functional groups (0.2-3), photoinitiator (0.1-3), photosensitizer and auxiliary agent (0.2-6) as raw materials, and curing process is making UV light curing, then carrying out electronic beam curing under vacuum, and then making UV light curing. The cation type UV light curing-curing system comprises (in parts by weight) epoxy resin or modified epoxy resin (35-45), epoxy resin or isocyanate or amino resin or free radical thermal curing agent (40-45), a diluent (0.4-9), cationic photoinitiator (0.1-3), photosensitizer and auxiliary agent (0.2-3) as raw materials, and curing process is either making UV light curing, then heating and curing and then making UV light curing, or heating and curing, then making UV light curing and then heating and curing. The cation type UV light curing-microwave curing system comprises (in parts by weight) epoxy resin or modified epoxy resin (35-45), epoxy resin or isocyanate or amino resin or free radical thermal curing agent (4O-45), a diluent (0.4-9), cationic photoinitiator (0.1-3), photosensitizer and auxiliary agent (0.2-3) as raw materials, and curing process is either making UV light curing, followed by curing ceramic gel via microwave and then making UV light curing, or carrying out microwave curing, then making UV light curing and then heating or microwave curing. The cation type UV light curing-anaerobic curing system comprises (in parts by weight) epoxy resin or modified epoxy resin (60-65), dimethacrylate polyol ester or bisphenol-A epoxy polyol ester (25-30), a diluent (0.4-9), cationic photoinitiator (0.1-3), photosensitizer and auxiliary agent (0.2-3) as raw materials, and curing process is making UV light curing, then performing anaerobic curing in absence of light under anaerobic condition, and then making UV light curing. The cation type UV light curing-electronic beam curing system comprises (in parts by weight) epoxy resin or modified epoxy resin (30-35), bisphenol A vinyl ester resin (50-55), a diluting agent (0.4-6), cationic photoinitiator (0.1-3), photosensitizer and auxiliary agent (0.2-3) as raw materials, and curing process is making UV light curing, then carrying out electronic beam curing under vacuum, and then making UV light curing. An INDEPENDENT CLAIM is also included for preparing the flexible substrate, comprising (i) cleaning a rigid substrate with surface roughness of less than 1 nm, then drying it by nitrogen blowing, (ii) forming the carbon nanotube layer on the rigid substrate by adopting spin coating, spray coating, self assembly, ink-jet printing or screen printing, then (iii) curing the carbon nanotube layer by using dual-curing system, where the dual-curing system has two independent curing stages, one is UV curing reaction and another one is dark reaction, the UV light curing reaction is UV light curing-microwave curing system, light curing-anaerobic curing system or UV light curing-electronic beam curing system, and (iv) carrying out UV light curing-thermal curing/microwave curing by either heating and curing/curing via microwave, then UV light curing, and then heating and curing/curing via microwave, or UV light curing, then heating and curing/curing via microwave, and then UV light curing, then (v) peeling the graphene or graphene doped with the dual-cure adhesive layer on the substrate to obtain a flexible conductive substrate, and (vi) testing its transmittance, electrical conductivity and surface parameters.