• 专利标题:   High heat conduction composite thermal interface material used for sealing and refrigerating and used when heat source temperature is higher than melting point of low melting point alloy, comprise low melting point alloy powder and graphene.
  • 专利号:   CN108329830-A
  • 发明人:   CAI C, CHEN L, YANG Y, YANG Z, XU X
  • 专利权人:   YUNNAN ZHONGXUAN LIQUID METAL TECHNOLOGY
  • 国际专利分类:   C09D183/04, C09D007/61, C09D005/25, C22C030/04
  • 专利详细信息:   CN108329830-A 27 Jul 2018 C09D-183/04 201860 Pages: 7 Chinese
  • 申请详细信息:   CN108329830-A CN10103851 01 Feb 2018
  • 优先权号:   CN10103851

▎ 摘  要

NOVELTY - High heat conduction composite thermal interface material comprises 10-60 wt.% low melting point alloy powder, 3-20 wt.% high thermal conductivity nano-powder, 1-4 wt.% graphene and balanced thermal grease. USE - High heat conduction composite thermal interface material used for sealing and refrigerating at a temperature of 0-15 degrees C and used when heat source temperature is higher than melting point of low melting point alloy by more than 10 degrees C (all claimed). ADVANTAGE - The high heat conduction composite thermal interface material has high coefficient, shows stable performance and good radiating effect, is prepared in a simple and easy manner, and is directly coated on the heating component. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing high heat conduction composite thermal interface material, which involves: (A) obtaining low melting point alloy powder by weighing two or more elemental metals, and then smelting and stirring in a vacuum melting furnace or inert gas protection heating furnace to obtain low melting point alloy; (B) subjecting the obtained low melting point alloy to crushing to obtain low melting point alloy powder, which meets the particle size requirement by an atomization method, mechanical grinding method or electrolytic deposition method; (C) weighing 10 wt.% low melting point alloy powder, 3-20 wt.% high thermal conductivity nano-powder, 1-4 wt.% cermetene and balanced thermal grease; (D) mixing low melting point alloy powder, high thermal conductive nano-powder and graphene in an ultrasonic processor, and then adding organic solvent to the ultrasonic processor, organic solvent in an amount exceeding 3-5 mm of the surface height of the mixed powder, and then subjecting mixed powder to ultrasonic stirring for 10-50 minutes to obtain mixed powder; and (E) ultrasonically oscillating the obtained mixed powder and placing weighed conductive silicone grease together in a stirring vessel for mechanical stirring for 30-90 minutes to obtain desired product.