• 专利标题:   Anti-corrosive metal housing for electronic device has metal substrate, passivation layer including oxyanion e.g. molybdate, vanadate, and/or manganese salt, and sealing layer including e.g. sodium silicate, zinc powder, and/or clay powder.
  • 专利号:   WO2022050948-A1
  • 发明人:   LI Y, CHUANG Y C, WU K
  • 专利权人:   HEWLETTPACKARD DEV CO LP
  • 国际专利分类:   B32B015/04, C23C022/06, G12B009/02
  • 专利详细信息:   WO2022050948-A1 10 Mar 2022 G12B-009/02 202231 Pages: 26 English
  • 申请详细信息:   WO2022050948-A1 WOUS049311 04 Sep 2020
  • 优先权号:   WOUS049311

▎ 摘  要

NOVELTY - An anti-corrosive metal housing (100) comprises metal substrate (102); passivation layer (110) including an oxyanion selected from molybdate, vanadate, phosphate, chromate, stannate, and/or manganese salt; and sealing layer (120) including sodium silicate, aluminum powder, zinc powder, graphene powder, and/or clay powder. USE - An anti-corrosive metal housing for an electronic device (claimed). ADVANTAGE - The anti-corrosive metal housing has excellent color stability, and is resistant to corrosion and finishes, and provides electronic device with excellent esthetic appearance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) electronic device comprising electronic component of an electronic device and the anti-corrosive metal housing to support the electronic components; and (2) application of anti-corrosion treatment to a metal substrate of a housing for an electronic device, which involves treating a metal substrate in an aqueous oxyanion passivation bath to form a passivated metal substrate, where oxyanion passivation bath includes 3-15 wt.% molybdate, vanadate, phosphate, chromate, stannate, and/or manganese salt, and treating the passivated metal substrate with an aqueous sealing dispersion to form the metal substrate with the anti-corrosion treatment on it, where the sealing dispersion includes 5-30 wt.% sodium silicate, aluminum powder, and/or zinc powder, and 0.1-3 wt.% graphene powder and/or clay powder. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of an anti-corrosive metal housing for an electronic device. Anti-corrosive metal housing (100) Metal substrate (102) Passivation layer (110) Sealing layer (120)