▎ 摘　　要

NOVELTY - The utility model claims a thin film flip chip package structure in turn lapped on a driving chip, a printing circuit film layer, the first adhesive layer, the flexible radiating layer, a second adhesive layer, and the first protective layer, the flexible radiating layer extends to the outer side is designed to form an extending part, the extending part comprises a first surface and a second surface opposite to the first surface and the second surface are provided with a second protective layer. The utility model claims a chip-on-film package structure capable of effectively radiating the driving chip, improving the running stability of the driving chip and prolong the service life thereof.