• 专利标题:   Composite material for electronic material, comprises graphene fiber as thermally conductive filler and thermoplastic polymer chosen from polyethylene, polypropylene, polytetrafluoroethylene, polyvinyl chloride and nylon.
  • 专利号:   CN104877234-A
  • 发明人:   ZHANG Y
  • 专利权人:   GUIZHOU NEW CARBON HITECH CO LTD
  • 国际专利分类:   C08K007/06, C08L023/06, C08L023/12, C08L027/16, C08L027/18
  • 专利详细信息:   CN104877234-A 02 Sep 2015 C08L-023/12 201606 Pages: 5 Chinese
  • 申请详细信息:   CN104877234-A CN10320144 11 Jun 2015
  • 优先权号:   CN10320144

▎ 摘  要

NOVELTY - A composite material comprises thermally conductive filler and thermoplastic polymer. The composite material is obtained by mixing thermally conductive filler and thermoplastic polymer, obtaining mixture, heating and mold-pressing. The thermally conductive filler is graphene fiber having diameter of 5-5000 mu m. The thermoplastic polymer is chosen from polyethylene, polypropylene, polyvinylidene fluoride, polytetrafluoroethylene, polyfluoroalkoxy terephthalate, polyphenylene sulfide, nylon, polymethyl methacrylate and polyvinyl chloride. USE - Composite material is used for electronic material. ADVANTAGE - The composite material has excellent mechanical property and thermal conductivity, is manufactured by economical process. DETAILED DESCRIPTION - A composite material comprises thermally conductive filler and thermoplastic polymer. The composite material is obtained by mixing thermally conductive filler and thermoplastic polymer for 0.5-24 hours, obtaining mixture comprising 0.1-35 %mass thermally conductive filler, heating to 170-280 degrees C and mold-pressing at 10-18 MPa. The thermally conductive filler is graphene fiber having diameter of 5-5000 mu m. The thermoplastic polymer is chosen from polyethylene, polypropylene, polyvinylidene fluoride, polytetrafluoroethylene, polyfluoroalkoxy terephthalate, polyphenylene sulfide, nylon, polymethyl methacrylate and polyvinyl chloride.