• 专利标题:   Graphene-based PCB copper-clad plate, comprises copper-clad laminate prepreg, copper foil and prepreg, and a layer of chemical vapor deposited graphene between copper foils.
  • 专利号:   CN108839407-A
  • 发明人:   ZHANG J, ZHANG Y, XU Y, FENG S, WANG Q
  • 专利权人:   UNIV NANJING
  • 国际专利分类:   B32B015/092, B32B015/14, B32B017/02, B32B017/06, B32B027/04, B32B027/18, B32B027/38, B32B033/00, B32B009/00, B32B009/04, C08L063/00, C08J005/24, C08G059/68, C08G059/50, C23C016/26
  • 专利详细信息:   CN108839407-A 20 Nov 2018 B32B-015/092 201905 Pages: 7 Chinese
  • 申请详细信息:   CN108839407-A CN10563709 04 Jun 2018
  • 优先权号:   CN10563709

▎ 摘  要

NOVELTY - Graphene-based PCB copper-clad plate, comprises copper-clad laminate prepreg, copper foil and prepreg, and a layer of chemical vapor deposited graphene between copper foils. USE - Used as graphene-based PCB copper-clad plate. ADVANTAGE - The plate has good thermal, electrical and mechanical properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the plate comprising (i) placing epoxy resin glass fiber prepreg in the chemical gas phase depositing device cavity for graphene growth and growing graphene on one surface or two surfaces, (ii) for growing graphene prepreg, prepreg of the growth with graphene side facing outside and not growing graphene on opposite, then according to the thickness of a copper-clad plate, adding 1-5 sheets of epoxy resin glass fiber prepreg in the middle according to the thickness of the copper plate to be coated, (iii) placing the copper foil on the upper and lower surfaces of the structure and placing in hot-pressing furnace, heat pressing, where the hot pressing condition is that the vacuum degree is pumped to greater than 1asterisk10-3 mbar after starting the heating, heating is firstly for 30-50 minutes and quickly heating to 150 degrees C, heating to 200-220 degrees C for 50-80 minutes, heat preservation for 60-120 minutes and the process of pressurization is divided into two steps, the pressure applied during the heating process is 4-5 MPa, and the pressure applied during the heat preservation process is 4.5-5.5 MPa, and (vi) naturally cooling to the room temperature and releasing, where the releasing speed should be less than 0.1MPa/s.