• 专利标题:   Copper-containing antibacterial polymer composite material useful as antibacterial and bacteriostatic materials in fields of home appliances, building materials, decorative materials, textiles, clothing, kitchen utensils, toilets, medical equipment and disinfection supplies.
  • 专利号:   CN114044992-A, CN114044992-B
  • 发明人:   LIAO B, LEI B, ZHU C, YANG T, GAO P, ZHANG J
  • 专利权人:   XIAMEN FUNANO NEW MATERIALS TECHNOLOGY
  • 国际专利分类:   C08K003/04, C08K003/08, C08K009/12, C08L027/06
  • 专利详细信息:   CN114044992-A 15 Feb 2022 C08L-027/06 202233 Chinese
  • 申请详细信息:   CN114044992-A CN11434287 29 Nov 2021
  • 优先权号:   CN11434287

▎ 摘  要

NOVELTY - Copper-containing antibacterial polymer composite material, comprises resin and copper ion antibacterial functional material dispersed in the resin, where the copper ion antibacterial functional material includes inorganic carrier, fullerenes and nano-copper supported on the surface of the inorganic carrier, and the nano-copper at least includes cuprous. USE - The copper-containing antibacterial polymer composite materials is useful as antibacterial and bacteriostatic materials in fields of home appliances, building materials, decorative materials, textiles, clothing, kitchen utensils, toilets, medical equipment and disinfection supplies (claimed). ADVANTAGE - The copper-containing antibacterial polymer composite material: has stable antibacterial and sterilizing effect; can meet the need of outdoor portable sterilizing and sterilizing; and can meet the requirement of adding in various scene application. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing copper-containing antibacterial polymer composite material comprising calcining and reducing copper ion antibacterial functional material precursor, then mixing and granulating the obtained copper ion antibacterial functional material and resin to obtain copper-containing antibacterial polymer composite material, where the copper ion antibacterial functional material precursor is fullerene-inorganic carrier-copper salt precipitate and/or fullerene-inorganic carrier-copper salt ball milling powder.