• 专利标题:   Heat-conducting wave absorbing gasket for electronic device, has heat conducting silica gel layer arranged between gasket main body and wave absorbing layer, where side wall of tensile layer is connected with graphene heat conducting film.
  • 专利号:   CN218456631-U
  • 发明人:   YANG X, CHEN C, YAN X
  • 专利权人:   DONGGUAN MEIHONG NEW MATERIAL TECHNOLOGY
  • 国际专利分类:   H05K001/02, H05K009/00
  • 专利详细信息:   CN218456631-U 07 Feb 2023 H05K-009/00 202315 Chinese
  • 申请详细信息:   CN218456631-U CN22353821 05 Sep 2022
  • 优先权号:   CN22353821

▎ 摘  要

NOVELTY - The utility model relates to the technical field of heat conducting gasket, and claims a heat-conducting wave absorbing gasket with good anti-stretching performance, comprising a gasket main body, the upper and lower sides of the gasket main body are fixedly connected with a wave absorbing layer, a first heat conducting silica gel layer is set between the gasket main body and the wave absorbing layer, the side wall of the wave absorbing layer far away from the first heat conducting silica gel layer is fixedly connected with a second heat conducting silica gel layer, the side wall of the second heat conducting silica gel layer far away from the wave absorbing layer is fixedly connected with an anti-stretching layer, the side wall of the anti-stretching layer far away from the second heat conducting silica gel layer is fixedly connected with a graphene heat conducting film. The utility model can improve the heat-conducting gasket anti-stretching ability, at the same time, it can make the heat-conducting gasket absorb the electromagnetic wave generated by the work of the element on the circuit board, which avoids the problem that the electromagnetic wave will cause slow operation of the electronic device and the data loss.