▎ 摘　　要

NOVELTY - The structure has package portion which is wrapped outside the solid crystal metal column (11). The material of the packaging portion is plastic. The electrode pins are fixed on the package portion and extend away from the package portion. The wire bond portion is arranged within the encapsulation portion for electrically connecting the electrode pins with LED chip. The material of the solid crystal metal column is titanium. A through hole extends along an axial direction of the solid crystal metal column. An aluminum column (11b) doped with graphene particles is arranged in the through hole. USE - Packaging structure of LED bracket. ADVANTAGE - The thermal stress generated between the LED chip and the solid crystal metal column is avoided, and high heat transfer efficiency is guaranteed. The light output efficiency is increased, and brightness and stability of the packaging bracket are improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing packaging structure of LED bracket. DESCRIPTION OF DRAWING(S) - The drawing shows a cross sectional view of the packaging structure of LED bracket. Solid crystal metal column (11) Area (11a) Aluminum column (11b) LED chip (20)