▎ 摘　　要

NOVELTY - The structure has a first non-woven layer provided with multiple fibers. The fibers are provided with non-woven material. The fibers are formed with multiple gaps. First graphene material is fixed in the gaps of the fibers. The first graphene material fills the gaps of the fibers to form a first non-woven heat dissipation layer. The multiple fibers comprise natural fibers, man-made fibers, or synthetic fibers, or a combination. A binder is mixed in the first graphene material. A heat dissipation layer is arranged on the first non-woven heat dissipation layer. The heat dissipation layer is a stainless steel substrate. USE - Bending-resistant heat dissipation structure for an electronic device (claimed). ADVANTAGE - The bending-resistant radiating structure is manufactured efficiently. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for (1) an electronic device; and (2) a method for manufacturing a bending-resistant heat dissipation structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of area A in the heat dissipation structure.