• 专利标题:   Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.
  • 专利号:   CN116120784-A
  • 发明人:   ZHENG N, SUN J, SHAO Z, WU B
  • 专利权人:   TAN KAH KEE INNOVATION LAB, UNIV XIAMEN
  • 国际专利分类:   C08J007/044, C08L101/00, C09D011/03, C09D011/102, C09D011/105, C09D011/107, C09D011/52, C25D005/56
  • 专利详细信息:   CN116120784-A 16 May 2023 C09D-011/52 202352 Chinese
  • 申请详细信息:   CN116120784-A CN11698816 28 Dec 2022
  • 优先权号:   CN11698816

▎ 摘  要

NOVELTY - A conductive ink comprises 5-50 pts. wt. resin binder, 1-30 pts. wt. conductive filler, 1-25 pts. wt. pore-forming agent and 5-50 pts. wt. solvent. USE - The conductive ink is used for preparing plastic material, which is used in electroplated plastic (all claimed) and for printing conductive points or conductive lines. ADVANTAGE - The conductive ink has good conductivity and good binding force, when applied to the electroplated plastic, the process is chromium-free and palladium-free, and less pollution, the electroplating process is simple, which effectively avoids the use of cumbersome process, high pollution and high cost of traditional technology containing chromium and palladium, and also improves the bonding force of the current direct electroplating technology. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: a method for preparing conductive ink comprising mixing the raw materials of the conductive ink; a method for preparing a plastic material comprising providing a plastic substrate and the conductive ink, coating the conductive ink on the surface of the plastic substrate, and drying; a plastic material obtained by the above method comprising a plastic base, and an ink layer formed on the surface of the plastic base; and an electroplated plastic comprising the plastic material and a metal plating layer, the metal plating layer is formed on the side of the ink layer away from the plastic substrate, where the metal of the metal plating layer is one or more of gold, silver, molybdenum, rhodium, palladium, copper, iron, tin, zinc, cobalt, nickel, chromium, cadmium, antimony, indium and bismuth.