▎ 摘　　要

NOVELTY - Forming a substrate in a substrate hole involves (a) pre-processing the surface of the insulating base material and the hole structure; (b) coating the graphene dispersion on the surface of the insulating base material and the hole structure in the step (a), applying different rotation radius and different rotating speeds to the insulating base at the same time to make the graphene form a conductive layer for metal plating; and (c) plating the insulating base material with the conductive layer in the step (b), where the graphene dispersion comprises water, binding auxiliary agent and water-soluble conductive polymer, the bonding auxiliary agent in the electroplating treatment for enhancing the covalent connection between the conductive layer and the electroplating metal and interacting with the groups on the surface of the pretreated insulating substrate and the hole structure and the thickness ratio of the substrate to the hole structure is 0.5-20:1. USE - The method for forming a substrate in a substrate hole is used in plating technology for metallization of rigid plate, flexible circuit boards, and non-metal surface (claimed). ADVANTAGE - The method enables to form substrate hole in film forming method that prevents blocking of the substrate hole with high thickness diameter, and improves the bonding strength of the electroplated metal and the conductive layer.