▎ 摘　　要

NOVELTY - The plasma etching anode plate has an anode plate main portion provided with multiple mounting positions. A through hole is individual detachably mounted on the mounting position. The convex groove is located at the periphery of the first through hole. A second through hole is arranged in the middle of plate portion. The periphery of the plate portion is provided with a groove matched with the convex groove. The anode plate main portion is an aluminium oxide plate. The individual through hole is made of metal material, and the surface of individual through hole is formed with a graphene film. USE - Plasma etching anode plate used in semiconductor processing manufacturing process comprising surface impurity cleaning, cutting and etching. ADVANTAGE - The worn individual through hole is replaced without changing the whole anode plate, so as to avoid waste, save the processing cost, and save the time of dismounting of the anode plates, and improve the production efficiency. The wear condition of the through hole is directly checked after each etching production is finished.