• 专利标题:   Preparing epoxy-based conductive and thermally conductive adhesive involves expanding graphene intercalation compound, graphene intercalation compound after thermal expansion is obtained, adding acetone and immersing graphene.
  • 专利号:   CN110256985-A, CN110256985-B
  • 发明人:   MENG Q, HAN S, CUI X, WANG S, YUE X, MA A, WANG Y
  • 专利权人:   UNIV SHENYANG AEROSPACE, UNIV SHENYANG AEROSPACE
  • 国际专利分类:   C09J011/04, C09J163/00, C09J009/02
  • 专利详细信息:   CN110256985-A 20 Sep 2019 C09J-009/02 201985 Pages: 12 Chinese
  • 申请详细信息:   CN110256985-A CN10573308 28 Jun 2019
  • 优先权号:   CN10573308

▎ 摘  要

NOVELTY - Preparing epoxy-based conductive and thermally conductive adhesive involves expanding graphene intercalation compound thermally at 650-800 degrees C for 1-2 minutes, graphene intercalation compound after thermal expansion is obtained, adding acetone, immersing graphene intercalation compound to graphene intercalation compound after thermal expansion, and ultrasonically stripping for 20-50 minutes to obtain graphene nanosheet solution, adding acetone to epoxy resin and mixing well to obtain epoxy resin acetone solution. The volume of acetone used is volume that is sufficient to dissolve epoxy resin, mix epoxy resin acetone solution andgraphene nanosheet solution, and ultrasonically shaked for 20-60 minutes to obtain epoxy/graphene mixed solution. The mixing ratio of the epoxy resin acetone solution and graphene nanosheet solution M/m is equal to k, where K is a proportional coefficient. USE - Method for preparing epoxy-based conductive and thermally conductive adhesive. ADVANTAGE - The method enables to prepare epoxy-based conductive and thermally conductive adhesive that improves performance of epoxy conductive heat conducting adhesive and solves problem that existing epoxy adhesive poor toughness, electric and heat conduction property is bad. DETAILED DESCRIPTION - Preparing epoxy-based conductive and thermally conductive adhesive involves expanding graphene intercalation compound thermally at 650-800 degrees C for 1-2 minutes, graphene intercalation compound after thermal expansion is obtained, adding acetone, immersing graphene intercalation compound to graphene intercalation compound after thermal expansion, and ultrasonically stripping for 20-50 minutes to obtain graphene nanosheet solution, adding acetone to epoxy resin and mixing well to obtain epoxy resin acetone solution. The volume of acetone used is volume that is sufficient to dissolve epoxy resin, mix epoxy resin acetone solution andgraphene nanosheet solution, and ultrasonically shaked for 20-60 minutes to obtain epoxy/graphene mixed solution. The mixing ratio of the epoxy resin acetone solution and graphene nanosheet solution M/m is equal to k, where K is a proportional coefficient, which is 0.5-2, M is a quality of the graphene nanosheet in the graphene nanosheet solution, m is the mass of graphene nanosheets in graphene nanosheet solution, quality of epoxy resin, quality of curing agent used in epoxy resin, ratio of curing agent, epoxy resin is (1-1.3):3.3, remove acetone and bubbles in epoxy/graphene mixed solution to obtain epoxy/graphene mixture. The curing agent is added to epoxy/graphene mixture and stirring to obtain epoxy-based conductive thermally conductive adhesive.