▎ 摘　　要

NOVELTY - Preparation of three-dimensional (3D) printing high power LED printed circuit board comprises mixing 10-30 pts. wt. graphene powder, 10-20 pts. wt. conductive photosensitive resin and 50-80 pts. wt. solvent, dispersing using ultrasonic wave, and grinding to less than 10 mu m to obtain graphene conductive ink; and adding 0.2-0.8 wt.% polyetheramine photocuring agent, stirring, injecting to inkjet head of SLA3D printer, designing print head according to pre-formed printed circuit layer design using computer control, spraying ink mixture on surface of high-power LED substrate, and emitting UV laser beam using argon ion laser to scan cross-section data of printed circuit layer line by line by point. USE - The method is for preparation of three-dimensional printing high power LED printed circuit board. ADVANTAGE - The circuit board has good mechanical properties and electrical conductivity.