▎ 摘　　要

NOVELTY - Preparation of polyimide film with low dielectric and high heat conductivity comprises preparing polyamic acid resin solution; and adding silver salt dispersion liquid and heat conducting filler dispersing slurry in the polyamic acid resin solution, uniformly mixing, and carrying out constant-temperature thermal decomposition, imidization and sizing treatment on the obtained mixed resin solution after casting to form a film so as to obtain a low-dielectric high-heat-conducting polyimide film. The silver salt dispersion liquid is silver salt dispersed in a polar aprotic solvent to form a solution, where silver salt is selected from silver nitrate, silver carbonate and/or silver oxalate, the adding amount of silver salt dispersion liquid is 0.1-10 wt.% of the solid content of the polyamic acid resin solution, and the heat-conducting filler dispersing slurry is formed by dispersing heat-conducting filler in polar aprotic solvent. USE - The method is for preparation of polyimide film with low dielectric and high heat conductivity (claimed). ADVANTAGE - The method provides film with low dielectric property and high heat conductivity while adding the heat-conducting filler in a small amount. DETAILED DESCRIPTION - Preparation of polyimide film with low dielectric and high heat conductivity comprises preparing polyamic acid resin solution; and adding silver salt dispersion liquid and heat conducting filler dispersing slurry in the polyamic acid resin solution, uniformly mixing, and carrying out constant-temperature thermal decomposition, imidization and sizing treatment on the obtained mixed resin solution after casting to form a film so as to obtain a low-dielectric high-heat-conducting polyimide film. The silver salt dispersion liquid is silver salt dispersed in a polar aprotic solvent to form a solution, where silver salt is selected from silver nitrate, silver carbonate and/or silver oxalate, the adding amount of silver salt dispersion liquid is 0.1-10 wt.% of the solid content of the polyamic acid resin solution, the heat-conducting filler dispersing slurry is formed by dispersing heat-conducting filler in polar aprotic solvent, the adding amount of heat-conducting filler dispersing slurry is 0.8-1.2 times the adding amount of silver salt, and the constant temperature thermal decomposition treatment is conducted at 190-220 degrees C for greater than or equal to 5 minutes. An INDEPENDENT CLAIM is included for polyimide film with low dielectric and high heat conductivity.