• 专利标题:   Growing of large-sized monocrystalline graphene on silicon carbide substrate used for microelectronic device, involves polishing silicon carbide substrate, introducing e.g. argon, placing probe on substrate and growing graphene on substrate.
  • 专利号:   CN106521618-A, CN106521618-B
  • 发明人:   CHEN X, CHENG X, MA Q, SUN L, XU X, YANG Z, YU F, ZHANG J, ZHAO X
  • 专利权人:   UNIV SHANDONG, SHANDONG BENYUAN CRYSTAL TECHNOLOGY CO, UNIV SHANDONG
  • 国际专利分类:   C30B025/02, C30B029/02
  • 专利详细信息:   CN106521618-A 22 Mar 2017 C30B-025/02 201734 Pages: 13 Chinese
  • 申请详细信息:   CN106521618-A CN10975636 07 Nov 2016
  • 优先权号:   CN10975636

▎ 摘  要

NOVELTY - Growing of large-sized monocrystalline graphene on silicon carbide substrate involves polishing and cleaning a silicon carbide substrate, placing the silicon carbide substrate in a graphite heater of high-temperature chemical-vapor deposition graphene growth furnace, introducing highly-pure argon and hydrogen, slowly heating, performing hydrogen etching, placing a fine thermally-conductive probe on the silicon carbide substrate, supplying carbon source gas, growing graphene on the substrate, obtaining large-sized monocrystalline graphene, introducing argon gas, and cooling the furnace. USE - Growing of large-sized monocrystalline graphene on silicon carbide substrate used for microelectronic device. ADVANTAGE - The method enables efficient growing of large-sized monocrystalline graphene on silicon carbide substrate, without requiring transfer of grown large-sized monocrystalline graphene. DETAILED DESCRIPTION - Growing of large-sized monocrystalline graphene on silicon carbide substrate involves polishing and cleaning a silicon carbide substrate, placing the silicon carbide substrate in a graphite heater of high-temperature chemical-vapor deposition graphene growth furnace, maintaining the vacuum degree in the growth chamber to 10-3-10-4 Pa, increasing furnace temperature to 1200-1300 degrees C, introducing highly-pure argon and hydrogen, maintaining the furnace pressure to 800-900 mbar, slowly heating to 1500-1600 degrees C for 10-15 minutes, performing hydrogen etching, terminating flow of hydrogen gas, slowly cooling the furnace to 1400-1500 degrees C for 10-30 minutes, reducing the furnace temperature to 800-1100 degrees C under argon atmosphere, placing a fine thermally-conductive probe on the silicon carbide substrate, maintaining the substrate temperature to 800-1100 degrees C, maintaining the furnace pressure to 800-900 mbar, supplying carbon source gas, growing graphene on the substrate, obtaining large-sized monocrystalline graphene, introducing argon gas, controlling furnace pressure to 800-900 mbar, slowly cooling to 600-700 degrees C, terminating flow of argon gas and cooling the furnace.