▎ 摘　　要

NOVELTY - The utility model claims a radiating structure of chip and electronic device, the radiating structure of the chip comprises circuit board chip and a chip, between the chip and the shell is filled with a heat conducting mechanism, the heat conducting mechanism comprises a connecting component, and a first heat conducting layer, a metal heat conducting piece and a second heat conducting layer; the first heat conducting layer is set between the chip and the metal heat transfer piece, the connecting component is set to connect the metal heat transfer piece and the circuit board; the second heat conducting layer is set between the metal heat conducting piece and the shell, the second heat conducting layer comprises a graphene foam filling piece, the graphene foam filling piece is set to be in the extrusion state and clings to the shell. The electronic device comprises a radiating structure of the chip. The utility model relates to a chip radiating field, claims a radiating structure of chip and electronic device, which not only ensures the radiating, but also uses graphene foam filling piece with large compressible amount, small compression force, which can avoid the stress problem. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device.