▎ 摘　　要

NOVELTY - A composite foam comprises a metal template and a conformal atomic-scale film comprising layer of graphene or hexagonal boron nitride. The metal template comprises sintered interconnects and has specified non-spherical pores, non-spherical porosity and surface-area-to-volume ratio. The film is arranged directly over the metal template to form a 3-dimensional interconnected structure and has specified non-spherical pores, non-spherical porosity, and a surface-area-to-volume ratio equal to that of metal template. The sintered interconnects comprises dendritic particles. USE - Composite foam used in electronics packaging industry as thermal interface material, heat sink and heat spreader. ADVANTAGE - The composite foam has high surface-area-to-volume and provides electrical components with high electrical, thermal and mechanical properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for fabrication of the composite foam.