▎ 摘　　要

NOVELTY - The material has a material main unit provided with a copper foil substrate and a graphite target. An epitaxial graphene layer is prepared on a surface of the copper foil substrate through low-temperature high-density plasma sputtering process. The material main unit constitutes thin low interface thermal resistance, where thickness of layers of the epitaxial graphene layer is about 0.3-30 nm. A side of the copper foil substrate is fixed with a heating source attached electronic product. The epitaxial graphene layer is provided with a D band, a G band and characteristic peaks of a 2D band in a Raman spectrometer. USE - Thin low interface thermal resistance high heat dissipation composite material. ADVANTAGE - The graphene layer is fixed on the metal copper foil, so that interface thermal resistance can be reduced when the composite structure to contact the heat source. The metal copper foil transfers heat to the graphene to quickly radiate heat to atmosphere, thus realizing high heat conducting and high heat dissipation process. DESCRIPTION OF DRAWING(S) - The drawing shows a front view of a thin low interface thermal resistance high heat dissipation composite material.