• 专利标题:   Heat transfer structure for electronic device, has heat transfer unit provided with thermal conductive element and graphene layer, where thermal conductive element is attached on graphene layer and end part of thermal conductive component is connected to unit.
  • 专利号:   CN209659835-U
  • 发明人:   XIAO Y, WEI L, HE M
  • 专利权人:   CTRON ADVANCED MATERIAL CO LTD
  • 国际专利分类:   H05K007/20
  • 专利详细信息:   CN209659835-U 19 Nov 2019 H05K-007/20 201992 Pages: 13 Chinese
  • 申请详细信息:   CN209659835-U CN22112360 17 Dec 2018
  • 优先权号:   CN22112360

▎ 摘  要

NOVELTY - The invention claims a heat transfer structure and electronic device with the heat transfer structure. thermal transfer structure comprises a heat dissipation unit, a heat-conducting adhesive piece and a heat transfer unit. heat dissipation unit has an end. heat-conducting adhesive piece is set on end of the heat dissipation unit. the heat transfer unit is set on the heat conducting adhesive, a heat transferring unit comprises the end of a thermally conductive element and a graphene layer, a heat conducting element attached on the graphene layer, and the thermal conductive component through heat conducting adhesive piece connected to the radiating unit; the heat energy radiating unit transmitting along a first direction through the heat transfer unit generates different to the first direction a second direction of heat transfer, and heat generating different to a third direction the second direction of transfer and dissipated out through the graphene layer.