▎ 摘　　要

NOVELTY - Metal bipolar plate comprises a metal substrate, and copper (Cu) nano layer which is deposited on the metal substrate. A graphene layer is prepared on the Cu nanolayer. The metal bipolar plate further comprises an amorphous carbon film, and the amorphous carbon film is deposited on the graphene layer. The metal bipolar plate further comprising a transition portion between the graphene layer and the amorphous carbon film, where composition of the transition portion includes graphene and amorphous carbon. The graphene layer is a bias plasma chemical vapor deposition coating. The Cu nanolayer is a physical vapor deposition coating. The Cu nanolayer is a multi-arc ion plating deposition coating. The amorphous carbon film is a bias plasma chemical vapor deposition coating, and/or the thickness of the amorphous carbon film is 50 nanometer-10 micrometer. USE - Metal bipolar plate. ADVANTAGE - The metal bipolar plate improves the corrosion resistance and conductivity of metal bipolar plates, improves binding force between the coating and the metal substrate, and extends service life of metal bipolar plates and fuel cells. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a method for preparing a metal bipolar plate, which involves depositing a Cu nano layer, depositing a Cu nano layer on the metal substrate, annealing treatment, heating the metal substrate on which the Cu nano layer is deposited to a set temperature, holding and cooling for a set time, and annealing and cooling, set temperature is 850-950 degrees C, and the set time is 30-120 minutes, preparing a graphene layer and a graphene layer on a Cu nanolayer, performing a degreasing treatment, a polishing treatment, a cleaning treatment, and a drying treatment on the metal substrate, performing surface ion sputtering and etching activation treatment on the metal substrate, using biased magnetron multi-arc ion coating device to perform surface ion sputtering and etching activation treatment on the metal substrate, sending metal substrate into the vacuum chamber, the vacuum degree of the vacuum chamber is evacuated to 1x 10-3-5x 10-3 Pascals (Pa); (2) heating metal substrate to 150-300 degrees C; (3) passing an inert gas or nitrogen gas into the vacuum chamber, and maintaining pressure of the vacuum chamber at 0.05-1Pa, subjecting metal substrate to surface ion sputtering and etching activation treatment for 3-15 minutes; and (4) a fuel cell, which comprises the metal bipolar plate. DESCRIPTION OF DRAWING(S) - The drawing shows schematic view of metal bipolar plate.