• 专利标题:   Conductive heat conducting film assembly for conducting heat conducting effect to electronic component, has conductive heat-conducting composite film layer that is set between first film layer and second film layer.
  • 专利号:   CN216614498-U
  • 发明人:   FANG Y
  • 专利权人:   ZHONGKE QINGKUN DONGGUAN TECHNOLOGY CO
  • 国际专利分类:   C09J007/29
  • 专利详细信息:   CN216614498-U 27 May 2022 C09J-007/29 202255 Chinese
  • 申请详细信息:   CN216614498-U CN23427024 31 Dec 2021
  • 优先权号:   CN23427024

▎ 摘  要

NOVELTY - The utility model model claims a conductive heat-conducting film assembly, comprising a first film layer, a conductive heat-conducting composite film layer, a second film layer and an adhesive layer, the conductive heat-conducting composite film layer is set between the first film layer and the second film layer, the conductive heat-conducting composite film layer is composed of a graphene layer and a carbon fiber layer, the adhesive layer is set on the lower surface of the second film layer. The conductive heat conducting film assembly has novel structure, smart design, capable of conducting heat conducting effect to electronic component good, and the heat accelerating in the process of the electronic component is transmitted and dispersed, meeting the use requirement of people.