▎ 摘　　要

NOVELTY - Processing dimming and toning integrated Chip-on-Board (COB) light source by (1) cutting aluminum nitride copper-clad substrate into predetermined size, coating photoresist on the surface of aluminum nitride copper clad substrate, baking at 95-100℃ for 12-20 minutes, exposing and developing to form a solid crystal groove (1)pattern, etching according to the solid crystal grooves pattern to form solid crystal grooves, performing resistance welding on the copper clad surface forming solid crystal grooves, drilling, and forming a packaging substrate, (2) taking package substrate, coating solid crystal glue in solid crystal groove, bonding chip, allowing to stand for 5-8 minutes, and curing, (3) connecting the chip with the packaging substrate by gold wire, forming a circuit path, surrounding the dam on the packaging substrate surface, filling the fluorescent glue in the surrounding dam, baking and curing, packaging, performing performance detection to obtain finished product. USE - Method for processing dimming and toning integrated carbon monoxide (COB) light source e.g. high power integrated surface light source, LED chip on mirror surface metal substrate with high reflectivity. ADVANTAGE - The method is simple and reasonable, the component proportion of the conductive adhesive is suitable, using the heat conducting and excellent conductive performance of the solid crystal glue, the heat dissipation efficiency of the prepared COB light source is improved. The arrangement of the chip is adjusted, the light source light emitting efficiency is improved, and the light emitting is more uniform. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for the COB light source prepared by the processing technique of dimming and toning integrated COB light source. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view showing the position of the die bonding groove on the surface of the packaging substrate. 1Solid crystal groove